Indium Corporation Features InFORMS Reinforced Solder Ribbon for Automated Assembly at NEPCON Japan 2018

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS^®, at NEPCON Japan 2018, Jan. 17-19, in Tokyo, Japan.

Indium Corporation is redefining solder with its patent-pending InFORMS solder ribbon for automated assembly. InFORMS solder ribbon is a composite fabrication consisting of solder and a reinforcing matrix that:

• Increases lateral strength
• Maintains bondline co-planarity
• Improves thermal cycling reliability

For more information about InFORMS, visit indiumstg.wpenginepowered.com/inform or stop to see us at the show at booth #E27-10.

如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer To^Another®”（#FOETA）。