Indium Corporation's Pony Liao, area technical manager for Northern China, presented at IPC Tianjin Technical Seminar on November 28.
Liao's presentation, The Application of Epoxy Flux, explained the benefits of using an epoxy flux for reinforcing CSP, BGA, flip-chip, and PoP assemblies to improve mobile phone performance against drop shock, thermal cycling, and dendrite risk. Epoxy flux also eliminates the drawbacks of underfill by integrating standard SMT solder pastes, fluxes, and underfill materials into a solitary reflow process to provide enhanced solder joints.
Liao is the area technical manager for northern China. He provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than 10 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction. Liao has a bachelor's degree from Tianjin University in mechanical and electronics engineering.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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