Indium Corporation’s Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.
Herron will present Various Ways to Minimize Voiding Under Bottom Terminated Components. This discussion will include the common challenge in SMT of voiding under bottom-terminated packages. Voids in the solder joints can lead to hot spots and component damage. Herron will outline possible ways to combat this challenge, including changes in stencil design, changes in board pad design, or the use of solder preforms. For more information on this workshop, visit www.zestron.com.
Herron has worked with the world renowned Dr. Ning-Cheng Lee in Indium Corporation's research and development laboratory for more than five years. In addition, his work with Indium Corporation’s Dr. Yan Liu focused on developments in solder paste and flux technologies. He has co-authored several research papers on the topic of QFN voiding. Herron has a bachelor’s degree in chemistry from Oklahoma State University, Stillwater, Oklahoma. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College and was certified in IPC-A-600 and IPC-A-610-D.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、新加坡、韩国、英国和美国设有工厂。
如需了解有关铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。
