Indium Corporation to Discuss Low-Voiding Options at SMTA Rocky Mountain

Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo.

Indium Corporation’s Indium8.9HF and Indium10.1 Solder Pastes:

• Are designed to provide ultra-low voiding
• Offer great print capabilities for small and low profile components
• Are designed to overcome head-in-pillow (HIP)
• Have excellent shelf and stencil life

“These industry-proven products satisfy a wide range of critical engineering requirements, as opposed to the single-purpose solutions you see on the market,” said Pat Ryan, America’s Sales Manager.

铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；^{以及NanoFoil®。}铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。

如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer To^Another®”（#FOETA）。