Indium Corporations Alloy Group R&D Manager Dr. HongWen Zhang will present on a high-temperature lead-free solder paste at the International Conference on Electronics Packaging (ICEP), supported by the International Microelectronics Assembly and Packaging Society (IMAPS), May 11-14 in Hokkaido, Japan.
The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment and clip-bond in power device applications. In his presentation, A Drop-In High-Temperature Pb-Free Solder Paste Outperforms High-Pb Pastes in Power Discrete Applications, Dr. Zhang examines a new formulation of Indium Corporations innovative material Durafusea novel design based on a mixed-alloy technologydesigned to deliver an Sn-rich HTLF paste, presenting the merits of both constituent alloys. This product, Durafuse HT, has shown the feasibility as a drop-in solution to replace high-Pb solders for die-attach in power discrete applications by delivering improved performance.
Dr. Zhang is manager of the alloy group in Indium Corporations R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joints morphology, thus improving reliability.
Dr. Zhang has a bachelors degree in metallurgical physical chemistry from Central South University of China, a masters degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a masters degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.
关于铟泰铟泰公司
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料精炼商、冶炼商、制造商和供应商。 产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度 、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
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关于 IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The societys portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the society has more than 50 years of networking, education, and publication history.
