CLINTON, N.Y., September 24, 2026 — Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will discuss formic acid soldering and its rise as a cutting-edge alternative for traditional flux within the electronics assembly space at PCB West, September 29-October 2, in Santa Clara, California.
The presentation, Advanced Reflow Technology: Formic Acid Soldering, will explore the fundamentals of formic acid reaction chemistry and its use in modern soldering processes. The session will demonstrate where, how, and at what scale formic acid is used, as well as key process parameters that influence solder joint formation. The presentation will also examine the advantages and limitations of formic acid reflow compared with traditional methods. Formic acid reflow with the addition of vacuum can enable a true no-clean process, achieve ultra-low voiding, and reduce environmental impact by eliminating the cleaning step and associated waste.
Ryan Mayberry leads the application development team for the Indium Corporation ESM product line. He collaborates across internal functions to develop process recommendations and support new product qualifications, primarily in the growing power electronics and thermal management market segments.
PCB West visitors can attend Mayberry’s presentation on September 30, 3:30 PDT. To learn more about Indium Corporation’s Formic Acid Soldering Technologies (FAST), visit indium.com or meet with our experts at PCB West booth 612.
关于铟泰铟泰公司
铟泰公司®是面向全球电子、半导体、薄膜及热管理 市场的顶级材料精炼商、冶炼商、制造商和供应商。 产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡金属及无机化合物 ；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度 、马来西亚 、墨西哥 、新加坡 、韩国、英国和美国设有工厂。
如需了解有关“铟泰公司 ”的更多信息，请访问www.indium.com或发送电子邮件至[email protected]。您还可以通过www.linkedin.com/company/indium-corporation/ 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
