Indium Corporation experts will share their technical expertise at a seminar for Manufacturing and Processes for High-Reliability and System-in-Package Applications on June 14 in Suzhou, China.
Wisdom Qu, Technical Manager for Eastern China, will present 01005/008004 Components Assembly Challenge.As the explosive growth of the Internet of Things (IoT) continues, so does the need for smaller and smaller passive and active electrical components. Qu will examine the effects of miniaturization on stencil printing and the reflow process. She will also discuss the results of small feature print experiments and her efforts to obtain consistent volume.
Pony Liao, Area Technical Manager, Northern China, will present The Reliability and Stability in the Solders for Automotive Electronics. Liao analyzes the higher requirements for solders in the automotive electronics industry, such as chemical stability, longevity requirements, and ultra-low voiding on power modules. He will also examine the industry’s needs concerning semiconductor packaging, substrate-level assembly, and security components requirements for SIR and ECM.
Qu provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and epoxy flux products. She is based in Suzhou, PRC. Qu has extensive experience in surface mount technology and has been with Indium Corporation since 2005. She earned a degree in mathematics from Hubei Radio and Television University in China, and is an SMTA Certified Process Engineer.
Liao provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than 10 years of experience in surface mount technology, specializing in defect prevention, quality continuous improvement, and cost reduction. Liao earned his bachelor’s degree from Tianjin University in mechanical and electronics engineering.
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
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