Three Indium Corporation experts will share their expertise at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, Boston, Massachusetts.
技术副总裁李宁成博士将主持题为 "实现无铅焊点的高可靠性--材料考虑 "的专业发展课程。 本课程的目的是让学员了解各种因素是如何导致失效模式的，以及如何选择适当的焊料合金和表面处理以实现高可靠性。
Lee 博士还将介绍用于倒装芯片和 SiP 组装的回流焊后粘度降低的新型助焊剂。他将讨论用于倒装芯片和硅片组装的助焊剂的开发。这些高粘度、高粘性助焊剂设计用于在贴片和回流焊阶段固定元件，因为它们在回流焊后会变为低粘度，从而允许清洗助焊剂残留物。
半导体产品区域产品经理Sze Pei Lim 将发表Flip-Chip Flux Evolution 的演讲， 探讨倒装芯片技术的发展和趋势，特别是作为关键装配工艺的倒装芯片互连。她将讨论与倒装芯片组装工艺相关的许多变量，以及随着该技术不可避免地进入汽车电子的大批量、零缺陷领域，对提高可靠性的需求。
化学研究员陈四海博士将展示他的互动海报《用于嵌入式贴片组装的传统回流炉可烧结无压银浆》。演讲回顾了无压银烧结材料的开发情况，该材料可作为一种插件工艺，使用通常用于焊料加工的传统对流回流炉。他将回顾研究过程中考虑的各种因素，包括焊膏优化、器件结构（如基板表面金属化）、接合点 BLT 和芯片尺寸。他还将探讨这些因素对 TCT 期间焊点可靠性的影响。
工程焊接材料高级产品经理Tim Jensen 将发表题为 "高性能液态金属热界面材料"的海报，回顾使用液态金属作为热界面材料 (TIM) 所面临的主要挑战，如泵出和湿气敏感性，以及克服这些挑战的一系列材料和工艺创新。
Indium Corporation advisor and founder/principal of DS&A LLC, David Saums, will present Design and Evaluation of a Thermal Interface Material Automated Cycling Durability Test Program. The paper, co-authored by Jensen and Ron Hunadi, Indium Corporation Market Development Manager, Semiconductor and Advanced Materials, evaluates a mechanical reliability test program developed and implemented for specialized TIMs to meet the very challenging requirements for the semiconductor test market.
Lee 博士是世界知名的焊接专家、SMTA 杰出会员和 IEEE 会员。他在为 SMT 行业开发助焊剂、合金和焊膏方面拥有三十多年的经验。他在高温聚合物、微电子封装材料、填充物和粘合剂的开发方面拥有丰富的经验。除 SMT 和半导体焊接材料外，他的研究还涉及纳米粘接技术和导热材料。李博士在许多行业刊物上发表过文章，并经常应邀在世界各地的报告会、研讨会、主题演讲和短期课程上发表演讲，其中许多演讲获得了 "最佳会议 "奖。
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore, is an SMTA-certified process engineer, and has earned her Six Sigma Green Belt. Lim has been with Indium Corporation since 2007.
Dr. Chen specializes in silver sintering paste product development. He has authored several Indium Corporation patents for silver sintering paste, thermal interface material, heat dissipating paint, and indium bump bonding. Dr. Chen has published in numerous journals, including the Journal of the American Chemical Society, Nano Letters, Langmuir, and The Journal of Physical Chemistry. He earned his doctorate in chemistry from the Chinese Academy of Sciences with a focus on metal and semiconductor nanomaterial synthesis. Dr. Chen also holds a Six Sigma Green Belt and has been certified as an IPC Specialist for IPC-A-610.
Jensen is an SMTA-certified process engineer. He has more than 20 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As a senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
To view additional papers authored by Indium Corporation’s experts, visit www.indium.com/techlibrary.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
