Indium Corporation will be featuring Heat-Spring® for IGBT Assembly at PCIM.
Indium Corporation's Heat-Spring is a compressible soft metal shim that serves as a thermal interface between the baseplate and heat-sink to ensure maximum heat transfer in IGBT and high power module mounting applications.
Heat-Spring 可满足大面积热传导要求，其金属传导特性高达 86 W/mK。与导热脂相比，Heat-Spring 易于使用，并具有优异的传导性。此外，Heat-Spring 不会烤出或抽出，从而优化了长期性能的一致性，并消除了返工过程。
Heat-Spring is reclaimable and recyclable, and can be packaged in custom trays or tape & reel. Indium Corporation also offers custom packaging options as needed.
Heat-Spring is just one of a wide range of Indium Corporation solders and TIMs for IGBT assembly. For more information, visit indiumstg.wpenginepowered.com/thermal-interface-materials/heat-spring or visit Indium Corporation at booth 7-441.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
