Indium Corporation’s Eric Bastow, assistant technical manager, will present at the International Microelectronics and Packaging Society (IMAPS) Metro Chapter in Ronkonkoma, NY, on Wednesday, September 26.
Bastow 的演讲题目是 "共晶 AuSn 合金交付选择和 LED 模具连接组装工艺的比较"，重点介绍了金锡合金及其满足当前环境立法严格要求的能力，以及组装现代电子设备所面临的挑战。
高亮度 LED 等大功率半导体器件必须使用一种芯片连接材料进行安装，这种材料必须能够承受芯片产生的温度波动，以及芯片材料与安装基板之间因 CTE 不匹配而产生的机械应力。芯片连接材料还必须符合当前的法律规定，即出于环保考虑，限制制成品中含有多种材料。金锡可以承受这些应力，具有良好的材料特性，并且无需助焊剂即可加工。
Bastow provides technical support for Indium Corporation’s full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets. He is a certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is also a certified IPC-A-600 and 610D specialist. IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, and professional development courses. IMAPS currently has more than 8,000 national and international members. For more information or to register for the event, call Steve Lehnert at 605-644-5218 or email [email protected]. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium metals and compounds; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
