Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its low-temperature alloy technology, Durafuse™ LT. The award was presented on Friday, July 3, in Shanghai, China, during Productronica China.
EM 创新奖计划旨在表彰电子行业的卓越成就，鼓励企业达到最高标准，推动行业发展。
Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse™ LT provides improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. Durafuse™ LT:
- 为热敏元器件 柔性聚合物提供解决方案
- 防止处理器元器件 多层电路板因热膨胀而变形
- Meets low-temperature requirements for step soldering, particularly in RF shield attachment and rework applications
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
