Indium Corporation‘s Evan Griffith, product specialist for semiconductor and advanced assembly materials, will host a webinar about the fundamentals of flip-chip bonding at 10 a.m. New York, Thursday, Sept. 15, as part of the company’s webinar programthe InSIDER Series.
Flip-chip bonding technology has a long history, stemming from its inception by General Electric in Indium Corporation’s hometown of Utica, New York, U.S. As such, the term “flip-chip” has evolved to encompass a wide variety of bonding technologies that solve various bonding challenges. In the most basic sense of the term, flip-chip bonding defines the bonding process in which the circuitry of a chip is manufactured face-down and flipped to be attached to a substrate.
In Flip-Chip 101, the history of flip-chip technology and the trends that have caused the manufacturing process to evolve will be discussed. Common failure modes in flip-chip assembly will also be touched on, as well as how material advancements have allowed for and will continue to push new technology in flip-chip bonding.
You may register for Griffith’s webinar at: indium.news/flip-chip101. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.
格里菲斯是SEMI/SAAM助焊剂和SiPaste材料的产品专家。他常驻于铟泰公司的全球总部，负责研究和分析客户及市场数据，并满足现有及潜在客户的需求。 此外，他还负责处理客户咨询、开展内部产品培训，并与铟泰公司的研发团队紧密合作，共同开发新产品应用 。他以优异成绩获得达特茅斯学院（位于美国新罕布什尔州汉诺威市）塞耶工程学院（Thayer School of Engineering）的材料科学工程学士学位，并获得了工程管理硕士学位。他还取得了六西格玛绿带认证。
关于铟泰铟泰公司
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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