Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the IMAPS Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on June 15 at Binghamton University in Vestal, N.Y.
Dr. Mackie’s presentation, Semiconductor Assembly and Materials Reliability for Evolving Automotive Electronics Applications, will review changes foreseen for the automotive industry, their impact on electronics in automotive manufacturing, and how materials suppliers are rising to meet these challenges. Topics will include challenges that materials suppliers face when developing and testing materials for the automotive semiconductor assembly industry; high-temperature, Pb-free solder paste for die-attach in discrete components and modules; sintering materials for die-attach for wide-band gap (GaN and SiC) devices; and controlling bondline thickness in IGBT module die-attach using solder preforms.
Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Dr. Mackie has a doctorate in physical chemistry from the University of Nottingham, U.K., and a Master of Science in Colloid and Interface Science from the University of Bristol, U.K. He is also formally trained in Six Sigma – Design of Experiments.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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