Lead-Free Solder Thermal Cycling & Drop Shock Reliability is Looking Good
Folks, I was at SMTAI (Surface Mount Technology Association International) from September 24 and 27, 2010. As I mentioned, I cha...
Folks, I was at SMTAI (Surface Mount Technology Association International) from September 24 and 27, 2010. As I mentioned, I cha...
Indium Corporation will be at IMAPS 2010 (International Microelectronics and Packaging Society) – their 43rd International Sympos...
This week’s topic is both wafer bumping and substrate bumping with solder paste, and the issue of powder size. I’ve recently been dea...
Over the past few years, I have been forced to come to terms with my current (and ever-growing) knowledge of “things”. It is easy to ...
Folks, Tin Whiskers (TW) continue to generate considerable interest. People often suggest that their risk is great and yet unknowable. RPN m...
My friend and colleague, Eric Bastow, got back last month from an IPC standards meeting with some interesting news for those of us who supply and use ...
I mentioned in a previous a blog posting that the primary driver for halogen-free electronics is ostensibly environmental, but that the confusion abou...
Folks, APEX 2010 appeared to be a great success. Attendance was high and my “Lead-Free Assembly” workshop broke a personal record of ...