Indium Corporation will feature its new reinforced matrixed solder composite, InFORMS® ESM02, which is specifically designed to produce consistent bondline thickness for die-level attach applications, at APEC 2019, March 17-21, Anaheim, California, USA.
Formulated to produce a high-reliability solder joint with increased thermal and mechanical performance, Indium Corporation’s InFORMS® ESM02 is an extension of the innovative family of InFORMS® products.
Until recently, InFORMS® technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS® include:
- Drop-in replacement for other bondline control methods
- Increased lateral strength
- Bondline co-planarity
- Improved thermal cycling reliability
- Availability in ribbon and preforms
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
