Indium Corporation will feature its new reinforced matrixed solder composite, InFORMS® ESM02, which is specifically designed to produce consistent bondline thickness for die-level attach applications, at APEC 2019, March 17-21, Anaheim, California, USA.
Formulated to produce a high-reliability solder joint with increased thermal and mechanical performance, Indium Corporation’s InFORMS® ESM02 is an extension of the innovative family of InFORMS® products.
Until recently, InFORMS® technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS® include:
- Drop-in replacement for other bondline control methods
- Increased lateral strength
- Bondline co-planarity
- Improved thermal cycling reliability
- Availability in ribbon and preforms
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
