Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, May 1-4 in Mesa, Ariz., U.S.
As an industry leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will feature selections from its portfolio of innovative high-performance metal TIM solutions.
Indium Corporations indium-containing TIMs for burn-in and test offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK. Its indium-containing TIMs are available as pure indium, indium-silver alloys, and indium-tin, among others. The pure indium TIM can be clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent the indium from adhering to the surface. Indium Corporations suite of Heat-Spring solutions, featuring a compressible interface between a heat source and a heat-sink, include:
Heat-Spring Preforms
- 花紋設計可優化與非平面表面的接觸，提供 86W/mK
- 提供燒錄頭與 DUT 的均勻接觸
- 提供更均勻的熱傳導性
- Cleans with no residue
- 可回收和再生
熱泉 HSK
- 特別推薦用於需要多次插入的預燒應用
- 為高密度熱負載提供低電阻的均勻接觸
- 通常覆蓋一層薄薄的擴散屏障，作為燒機和測試應用的接觸面
- 無染色或裂紋
熱泉 HSD
- 專為緊密表面控制 >30psi 的介面所設計
- Recommended for small, well-designed interfaces with flat, smooth, parallel surfaces
To learn more about Indium Corporations metal TIMs for burn-in and test, visit www.indium.com/TIMs.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
About TestConX
Over the course of its 22-year history,TestConX has established itself as the preeminent event for test consumables, test cell integration, and test operations. The program scope has expanded over these years from packaged semiconductor final test and burn-in to encompass all practical aspects of electronics testing including validation, advanced packaging testing, system level test, module test, and beyond to finished product test.
