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Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX

Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, May 1-4 in Mesa, Ariz., U.S.

As an industry leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will feature selections from its portfolio of innovative high-performance metal TIM solutions.

Indium Corporations indium-containing TIMs for burn-in and test offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK. Its indium-containing TIMs are available as pure indium, indium-silver alloys, and indium-tin, among others. The pure indium TIM can be clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent the indium from adhering to the surface. Indium Corporations suite of Heat-Spring solutions, featuring a compressible interface between a heat source and a heat-sink, include:

Heat-Spring Preforms

  • 图案设计优化了与非平面表面的接触,可提供 86W/mK 的功率
  • 在预烧头和 DUT 之间提供均匀接触
  • 提供更均匀的导热性
  • Cleans with no residue
  • 可回收和再生

热弹簧 HSK

  • 特别推荐用于需要多次插入的预烧应用
  • 为高密度热负荷提供低阻力的均匀接触
  • 通常覆有一层薄薄的扩散屏障,作为预烧和测试应用中的接触面
  • 无染色或开裂

热泉 HSD

  • 专为具有严格表面控制 >30psi 的接口而设计
  • Recommended for small, well-designed interfaces with flat, smooth, parallel surfaces

To learn more about Indium Corporations metal TIMs for burn-in and test, visit www.indium.com/TIMs.

关于铟泰铟泰公司

铟泰公司是全球电子、半导体、薄膜和热管理市场首屈一指的材料精炼商、冶炼商、制造商和供应商。 产品涵盖焊料与助焊剂、硬焊料、热界面材料、溅射靶材、铟、镓、锗、锡等金属及无机化合物,以及NanoFoil™( )。公司创立于1934年,拥有全球技术支持体系,工厂遍布中国、德国、印度、马来西亚、新加坡、韩国、英国及美国。

如需了解更多铟泰公司信息,请访问www.indium.com或发送邮件至黄静雅。您还可关注我们的专家团队"工程师同行"(,#FOETA)的推特账号www.linkedin.com/company/indium-corporation/@IndiumCorp

About TestConX

Over the course of its 22-year history,TestConX has established itself as the preeminent event for test consumables, test cell integration, and test operations. The program scope has expanded over these years from packaged semiconductor final test and burn-in to encompass all practical aspects of electronics testing including validation, advanced packaging testing, system level test, module test, and beyond to finished product test.