Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, May 1-4 in Mesa, Ariz., U.S.
As an industry leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will feature selections from its portfolio of innovative high-performance metal TIM solutions.
Indium Corporations indium-containing TIMs for burn-in and test offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK. Its indium-containing TIMs are available as pure indium, indium-silver alloys, and indium-tin, among others. The pure indium TIM can be clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent the indium from adhering to the surface. Indium Corporations suite of Heat-Spring solutions, featuring a compressible interface between a heat source and a heat-sink, include:
Heat-Spring Preforms
- 图案设计优化了与非平面表面的接触，可提供 86W/mK 的功率
- 确保老化头与测试设备 ( DUT )之间保持均匀接触
- 提供更均匀的热导率
- Cleans with no residue
- 可回收和再生
热弹簧 HSK
- 特别推荐用于需要多次插拔应用
- 可提供均匀的接触面，且接触电阻低，适用于密度 负荷
- 通常覆有一层薄的扩散屏障，该屏障在预烧测试 应用用作接触面
- 无污渍或开裂
热泉 HSD
- 专为具有严格表面控制 >30psi 的接口而设计
- Recommended for small, well-designed interfaces with flat, smooth, parallel surfaces
To learn more about Indium Corporations metal TIMs for burn-in and test, visit indiumstg.wpenginepowered.com/TIMs.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至Jingya Huang。您还可以关注我们的专家团队“From One Engineer To Another”（#FOETA），访问www.linkedin.com/company/indium-corporation/或关注@IndiumCorp。
About TestConX
Over the course of its 22-year history,TestConX has established itself as the preeminent event for test consumables, test cell integration, and test operations. The program scope has expanded over these years from packaged semiconductor final test and burn-in to encompass all practical aspects of electronics testing including validation, advanced packaging testing, system level test, module test, and beyond to finished product test.
