As one of the leading materials providers to the electronics assembly industry, Indium Corporation is proud to feature its innovative Durafuse solder technology at Productronica India, September 11-13, in Delhi, India.
Indium Corporation 將展示下列特色產品：
- Durafuse LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It’s ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
- Durafuse HR 以新型焊膏合金技術為基礎，可提供更強的熱循環性能 (-40C/125C 和 -40C/150C) 和優異的空泡性能，適用於高可靠性的汽車應用。此外，它還能減少焊點開裂並提高剪切強度。
- Durafuse HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse HT can drop in to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
Some of the additional products featured will include:
- Indium8.9HF Solder Paste Series, an industry-proven solder paste series, delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
- Indalloy301 LT Alloy for Preforms/InFORMS is a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
- SiPaste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance.
- Heat-Spring solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK in all planes.
- NC-809 is Indium Corporations first no-clean, ball-attach flux on the market. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
To learn more about Indium Corporations solutions, visit our experts at Productronica India in hall 14, booth H14.B65.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
