As one of the leading materials providers to the electronics assembly industry, Indium Corporation is proud to feature its innovative Durafuse solder technology at Productronica India, September 11-13, in Delhi, India.
铟泰公司 其推荐产品中展示以下产品：
- Durafuse LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It’s ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
- Durafuse HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40C/125C and -40C/150C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Durafuse HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse HT can drop in to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
Some of the additional products featured will include:
- Indium8.9HF Solder Paste Series, an industry-proven solder paste series, delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
- Indalloy301 LT Alloy for Preforms/InFORMS is a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
- SiPaste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance.
- Heat-Spring solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK in all planes.
- NC-809 is Indium Corporations first no-clean, ball-attach flux on the market. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
To learn more about Indium Corporations solutions, visit our experts at Productronica India in hall 14, booth H14.B65.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
