It is easy to get burned during the burn-in and test process if you don't use the right thermal interface material. In addition to the old-fashioned thermal interface materials, you have two modern, high-performance metal thermal interface material (mTIM) options to from which to choose:
铟是目前最好的金属热界面材料，因为它：
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导热性强（86W/m K）
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使用简便、清洁
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适用于多次插入
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唾手可得
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证据确凿
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可回收
Our Heat-SpringR mTIM's unique pattern provides uniform contact between the chip and the burn-in head, giving you the best thermal conductivity because there are no voids which can produce hot spots.
聚酯粘合剂 mTIM：
Another option is our HSMF-OS mTIM. This is a multi-layer aluminum and non-silicone polymer that has a gently-tacky side to help the interface stay in exactly the right place. This material is perfect for applications that are larger in area or that do not require the higher thermal conductivity of indium. There is no pattern in this material, so your surfaces need to be fairly flat. But, it is very durable and will give you a high insertion rate.
You can see both high-performance mTIM options at the BiTS workshop in Phoenix, AZ, March 5-8, 2017. In addition to displaying these products, our burn-in experts will be on-hand to discuss your applications.
我们还将共同发表一篇题为"预烧金属热界面材料选择 "的论文。周一上午，我们将赞助 Integrated Solutions Group 的 Thomas Sonderman 发表主题演讲。
