Indium Corporation Advisor to Present at TestConX 2019

Indium Corporation advisor and founder/principal of DS&A LLC, David Saums, will present at TestConX 2019 from March 3-6, in Mesa, Arizona, USA.

Saumswill present Design of a Four-Phase Mechanical Cycling Reliability Test Program and Evaluation Results for TIMs Designed for Semiconductor. The paper, co-authored by Tim Jensen, Product Manager for Engineer Solder Materials, and Ron Hunadi, Market Development Manager, Semiconductor and Advanced Materials, evaluates the durability of selected thermal interface materials (TIMs) under mechanical contact cycling equivalent to semiconductor testing. 

If you cannot attend TestConX and want to know more about this topic, please contact Tim Jensen at [email protected] or visit indiumstg.wpenginepowered.com/thermal-interface-materials.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer To^Another®”（#FOETA）。