Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at the China Semiconductor Packaging Test (CSPT) Technology & Marketing Annual Conference, September 8-10, Wuxi, China.
WS-446HF flux is a robust, NIA (no intentionally added) halogen-free, water-wash flux that is designed to provide one simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. It has a powerful activator system to promote good wetting on even the most demanding substrate metallizations, such as Cu OSP, ENEPIG, and ENIG. WS-446HF helps to improve production yield by minimizing non-wet open defects, missing balls, and eliminating electrochemical migration (ECM). WS-446HF:
- Promotes excellent solderability and wetting on a wide range of surfaces
- Cleans well with room temperature DI water
- Eliminates ECM or dendrite formation caused by residue
From water-soluble and ultra-low/near-zero residue no-clean flip-chip fluxes to system-in-package (SiP) water-soluble and no-clean solder pastes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP and Heterogeneous Integration applications.
For more information on Indium Corporation’s materials for SiP, visit indiumstg.wpenginepowered.com/SiP or visit Indium Corporation’s booth.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
