Indium Corporation will feature its new combined flip-chip and ball-attach flux, designed to provide a simple solution to SiP and flip-chip BGA assembly, at IEEE EPTC Singapore 2019, December 4-6, in Singapore.
WS-446HF is a water-soluble, halogen-free flux with an activator system powerful enough to promote good wetting on the most demanding surfaces, including solder-on-pad (SoP), Cu-OSP, ENIG, and surfaces used in embedded trace substrate (ETS), and flip-chip on leadframe (FCOL) .
WS-446HF provides:
- An activator chemistry powerful enough to deal with a variety of metallizations, yet cleans away completely to eliminate electrical failures such as dendrites. This is critical for fine-pitch flip-chip applications
- Tackiness suitable for flipchip and BGA assembly
- BGA: holding 0.15–0.5mm diameter solder spheres during reflow, eliminating missing balls
- Flip-chip: Retaining 5×5–15x15mm die in place during reflow, reducing die misalignment and die tilt
- Consistent deposition in pin transfer, printing, and dipping processes, ensuring consistent joint quality and improving production yields
- Elimination of multiple fluxing steps, especially in ball-attach assembly, enabling a single-step ball-attach process thus removing the warpage-inducing effects of prefluxing
- Good cleanability with room temperature DI water (20-35°C), avoiding the formation of white residue
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
