Indium Corporation to Feature New Semiconductor Products for HIA and SiP at IMAPS Device Packaging Conference

As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporationwill feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20^th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 1821, in Fountain Hills, AZ. 

Indium Corporation’s proven SiPaste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology. 

Indium Corporation’s newest jetting solder paste, PicoShot NC-6M, is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot NC-6M is optimized for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6nL/dot. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues. 

To learn more about Indium Corporation’s innovative solutions for HIA and SiP, visit our experts at booth #56 at IMAPS Device Packaging Conference or online at indium.com/HIA.

关于铟泰铟泰公司

铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。

For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.