This is the second in a series of blog posts that talks about Reinforced Solder Preforms for High–Reliability and Low Voiding. This post will focus on the technology advancement of InFORMS® and their role in high-power applications.
InFORMS® are a patented technology that comprises a high melting-point metal stand-off within a traditional solder preform. The solder can be any alloy currently used in electronics – SAC305 is common. The stand-off thickness is very precise because it is based on the desired final solder joint bondline. These preforms can be flux-coated for the application if needed . A representative image of the InFORM® is shown below.
在回流过程中，焊料熔化并与元件和电路板形成金属间结合。元件在回流过程中会塌陷。由于支座材料的熔点较高，在焊接温度下不会熔化。因此，元件的塌陷仅限于支座的厚度。最终的焊接线将保持一致，因为支座材料是按照整个焊接区域均匀一致的精确厚度制造的。
InFORM® 的制造方法多种多样。支座材料的厚度至关重要，需要根据所需的最终键合线来指定；常用的厚度为 0.004、0.006 和 0.008 英寸。此外，支座周围的可焊接区域也很重要。开口的大小可以根据支座材料的设计来确定。
The overall thickness of the preform and the quantity of flux are also very important. The preform thickness must be greater than the stand-off. For example, if you select a 0.004-inch stand-off, the overall preform must be at least 0.006 inches thick. If you are using a flux coating on the preform, it is important to understand that the quantity of flux can impact solder wetting and voiding.
下一篇文章将讨论债券线的一致性及其重要性。
下次再见
亚当
