Indium Corporation and Duksan Hi-Metal Co., Ltd. announce a formal agreement to facilitate the global supply of an advanced alloy technology used to manufacture solder balls (spheres) for semiconductor packages. SACm™, a novel alloy composition developed by Indium Corporation, provides the foremost reliability performance in terms of both drop-shock and thermal cycling. Solder joint architectures that utilize both SACm™ solder paste and SACm™ solder balls realize the maximum value of this alloy technology. Duksan Hi-Metal, the second largest solder ball supplier in the industry, provides cost-effective manufacturing capability for SACm™ solder balls, coupled with world-class quality.
“We couldn’t be any happier with our selection of Duksan Hi-Metals as our strategic partner to bring SACm™ balls to market,” said Chris Bastecki, Indium Corporation’s Associate Director of Electronics Assembly Materials. “The challenge of effectively and repeatedly incorporating the proprietary dopant into SACm™ solder balls is quite complex. The engineers at Duksan have demonstrated great skill and capability with their ability to scale the process up to a viable commercial process within a short period of time.”
"我们很高兴能够为客户提供 SACm™ 技术，"Duksan 销售总监 Perry Kim 说。"我们的客户一直面临着提高可靠性、避免板级底部填充以及将半导体封装的使用扩展到更大芯片尺寸的挑战。如果我们能让客户通过经济高效地应用 SACm™ 焊球实现这些改进，我们非常乐意提供帮助。
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
Duksan Hi-Metal Co., Ltd. 成立于 1999 年，生产用于 BGA 和 CSP 组装的焊球。公司总部位于韩国，与中国、日本、台湾、菲律宾、新加坡和欧洲的客户都有业务关系。Duksan 已通过 ISO 14002:2000 认证。
For more information about Indium Corporation, visit www.indium.com or email [email protected].
