Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste series to help customers Avoid the Void® at SMTconnect, May 7-9, in Nuremberg, Germany.
The Indium8.9HF series is a proven product that delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding—plus enhanced electrical reliability and improved stability—during the printing process. Under optimal process conditions, this series:
- Exceeds all requirements for enhanced electrical reliability and SIR performance
- Demonstrates consistent printing performance for up to 12 months when refrigerated
- Maintains excellent printing and reflow performance after remaining at room temperature for one month
- Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
- 防止助焊剂过早扩散，防止表面氧化
- Performs with both Pb and Pb-free alloys
The Indium8.9HF Solder Paste series provides a unique oxidation barrier technology that eliminates HIP defects and graping, making them perfectly suited for automotive assembly and a variety of electronics assembly applications. In fact, the product meets HKMC MS184-01 testing criteria Type B, one of the toughest automotive criteria to ensure reliability.
For information on how Indium8.9HF can help you Avoid the Void®, visit Indium Corporation in hall 5, booth 310, or https://www.indium.com/avoidthevoid.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
