Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste series to help customers Avoid the Void® at SMTconnect, May 7-9, in Nuremberg, Germany.
The Indium8.9HF series is a proven product that delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding—plus enhanced electrical reliability and improved stability—during the printing process. Under optimal process conditions, this series:
- 超出所有要求，增强电气可靠性和 SIR 性能
- Demonstrates consistent printing performance for up to 12 months when refrigerated
- Maintains excellent printing and reflow performance after remaining at room temperature for one month
- Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
- 防止助焊剂过早扩散，防止表面氧化
- 适用于铅合金和无铅合金
The Indium8.9HF Solder Paste series provides a unique oxidation barrier technology that eliminates HIP defects and graping, making them perfectly suited for automotive assembly and a variety of electronics assembly applications. In fact, the product meets HKMC MS184-01 testing criteria Type B, one of the toughest automotive criteria to ensure reliability.
For information on how Indium8.9HF can help you Avoid the Void®, visit Indium Corporation in hall 5, booth 310, or https://www.indium.com/avoidthevoid.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、马来西亚、新加坡、韩国、英国和美国均设有工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家 From One Engineer ToAnother®(#FOETA) 。
