Indium Corporation has added to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components.
SiPaste C201HF combines superior, industry-leading non-wet open (NWO) performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields. It leaves behind a cleanable residue, able to be removed with a commercially available semi-aqueous cleaning solution, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not applicable.
SiPaste C201HF features excellent transfer efficiency on fine feature apertures, with consistent process yields below 80m.
SiPaste C201HF delivers:
- Consistent and tight solder deposit spread across multiple prints; excellent response-to-pause performance
- Minimal voiding on tight-pitch components, ensuring joint strength on small components
- Excellent reflow performance on components that exhibit high warpage
- Enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components
- 清洗灵活；可用于需要用皂化剂清洗或不需要清洗的工艺中
For more information about Indium Corporation’s pastes for fine feature printing, contact Evan Griffith, Product Specialist – Semiconductor and Advanced Assembly Materials.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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