Indium Corporation will feature its new high-performance, high-reliability low-temperature alloy technology at Productronica, November 12-15, Munich, Germany.
DurafuseTM LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, DurafuseTM LT provides improved drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup. DurafuseTM LT:
- 为热敏元件和柔性聚合物提供解决方案
- 防止处理器组件和多层电路板发生热翘曲
- 满足台阶焊接的低温要求，特别是在射频屏蔽连接和返工应用中
To learn more about Indium Corporation’s innovative low-temperature technology, visit the company at Productronica, Hall A4, Booth 214 or online at indiumstg.wpenginepowered.com/solders/solder-alloys/.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
