Indium Corporation Vice President of Technology Dr. Ning-Cheng Lee was recognized for Best Presentation of Technology Conference One at NEPCON China (Shanghai) 2011 by Surface Mount Technology Association (SMTA) China East.
Dr. Lee presented Voiding Control for QFN Assembly, which included the challenges and most effective practices for controlling voids during the QFN assembly process. According to Dr. Lee, "Voiding behavior of the QFN can be controlled by improved design in the thermal pad, thermal via, and reflow profile." A copy of Dr. Lee’s paper is available at indiumstg.wpenginepowered.com/techlibrary/whitepapers.
Lee 博士是世界知名的焊接专家，也是 SMTA 的杰出会员。他在高温聚合物、微电子封装材料、填充物和粘合剂的开发方面拥有丰富的经验。他目前的研究兴趣涵盖电子和光电应用领域中用于互连和封装的先进材料，重点是高性能和低成本。
For more information about NEPCON China (Shanghai), visit www.nepconchina.com/.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
