Indium Corporation Vice President of Technology Dr. Ning-Cheng Lee was recognized for Best Presentation of Technology Conference One at NEPCON China (Shanghai) 2011 by Surface Mount Technology Association (SMTA) China East.
Dr. Lee presented Voiding Control for QFN Assembly, which included the challenges and most effective practices for controlling voids during the QFN assembly process. According to Dr. Lee, "Voiding behavior of the QFN can be controlled by improved design in the thermal pad, thermal via, and reflow profile." A copy of Dr. Lee’s paper is available at www.indium.com/techlibrary/whitepapers.
Lee 博士是世界知名的焊接专家，也是 SMTA 的杰出会员。他在高温聚合物、微电子封装材料、填充物和粘合剂的开发方面拥有丰富的经验。他目前的研究兴趣涵盖电子和光电应用领域中用于互连和封装的先进材料，重点是高性能和低成本。
For more information about NEPCON China (Shanghai), visit www.nepconchina.com/.
Indium Corporation 是全球电子、半导体、太阳能、薄膜和热管理市场的主要材料供应商。产品包括焊料、预型件和助焊剂；钎料；溅射靶材；铟、镓和锗化学品及采购；以及 Reactive NanoFoil®。Indium 公司成立于 1934 年，在中国、新加坡、韩国、英国和美国都有全球技术支持和工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。
