Indium Corporation's Andy C. Mackie, PhD, MSc, senior product manager for semiconductor and advanced assembly materials, was presented with the 2014 William D. Ashman Award at the 47th International Symposium on Microelectronics on Oct. 14 in San Diego, Calif.
William D. Ashman 奖旨在表彰为电子封装行业做出重大技术贡献，同时参与并支持提升电子封装专业水平活动的个人。
Mackie 博士是 IMAPS 帝国分会主席和《芯片级评论》杂志编辑顾问委员会主席。2014 年，他在Semiconductor Packaging News、EP&P（欧洲）和Chip Scale Review 上发表了文章。Mackie 博士还担任过 IMAPS 研讨会的主持人和主席。
"Mackie博士对推动微电子行业和电子封装技术的承诺和热忱使他成为真正的领导者，"IMAPS前任总裁兼颁奖委员会主席Voya Markovich说。"我们很荣幸能够授予他这个奖项"。
Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Dr. Mackie has a doctorate in physical chemistry from the University of Nottingham, U.K., and a Master of Science (MSc) in colloid and interface science from the University of Bristol, U.K. Additionally, he is formally trained in Six Sigma – Design of Experiments.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses, and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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