CLINTON, N.Y., May 15, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of next-generation electronics packaging at the China Semiconductor Packaging and Testing (CSPT) exhibition, May 28-29, in Jiangsu, China.
The presentation, titled High-Reliability Metal TIM Solutions for Advanced Packaging, examines how metal TIMs—including pure indium and indium-based alloys—overcome the limitations of traditional polymer-based barriers through superior thermal conductivity and ultra-low thermal resistance. Through innovative alloy formulation, optimized interface engineering, and precise process control, these solutions significantly enhance system cooling efficiency and long-term device reliability.
Leo Hu is a senior area technical manager for East China and is based at Indium Corporation’s Suzhou facility. In this role, he manages the regional technical support team and partners with the company’s global organization to provide customer product and application solutions. Hu has more than 15 years of experience in semiconductor packaging, specializing in advanced assembly technology development, process improvement, and assembly materials applications.
CSPT attendees can attend Hu’s presentation on May 28, 4:10 p.m. China Standard Time (UTC+8). To learn more about Indium Corporation’s complete portfolio of TIMs solutions, visit the website.
インジウム・コーポレーションについて
インジウム・コーポレーション®は、世界のエレクトロニクス、半導体、薄膜、および熱管理市場向けに、素材の精製、製錬、製造、供給を行うトップクラスの企業です。 製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズなどの金属および無機化合物、ならびにNanoFoil®が含まれます。1934年に設立された同社は、世界的な技術サポート体制を整備しており、中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を構えています。
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
