CLINTON, N.Y., May 15, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of next-generation electronics packaging at the China Semiconductor Packaging and Testing (CSPT) exhibition, May 28-29, in Jiangsu, China.
The presentation, titled High-Reliability Metal TIM Solutions for Advanced Packaging, examines how metal TIMs—including pure indium and indium-based alloys—overcome the limitations of traditional polymer-based barriers through superior thermal conductivity and ultra-low thermal resistance. Through innovative alloy formulation, optimized interface engineering, and precise process control, these solutions significantly enhance system cooling efficiency and long-term device reliability.
Leo Hu is a senior area technical manager for East China and is based at Indium Corporation’s Suzhou facility. In this role, he manages the regional technical support team and partners with the company’s global organization to provide customer product and application solutions. Hu has more than 15 years of experience in semiconductor packaging, specializing in advanced assembly technology development, process improvement, and assembly materials applications.
CSPT attendees can attend Hu’s presentation on May 28, 4:10 p.m. China Standard Time (UTC+8). To learn more about Indium Corporation’s complete portfolio of TIMs solutions, visit the website.
关于铟泰铟泰公司
铟泰公司®是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
