Indium Corporation has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications.
Indium Corporation's InFORMS® ESM02 is a reinforced solder fabrication that produces a high-reliability solder joint with increased thermal and mechanical performance.
Until recently, InFORMS® technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS® include:
- Drop-in replacement for other bondline control methods
- Increased lateral strength
- Bondline co-planarity
- Improved thermal cycling reliability
- Available in ribbon and preforms
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Standard InFORMS® Configurations |
|
|
说明 |
Standoff (Microns) |
|
LM04 |
100 |
|
LM06 |
150 |
|
LM08 |
200 |
|
SM04 |
100 |
|
ESM03 |
75 |
|
ESM02 |
50 |
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、马来西亚、新加坡、韩国、英国和美国均设有工厂。
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