Indium Corporation was honored with a Global Technology Award during an award ceremony on October 22, 2024, at SMTA International in Rosemont, Illinois. The company received the recognition in the solder paste category for Indium8.9HFRV, a low-voiding, air reflow, no-clean solder paste that offers excellent stencil print transfer efficiency, response-to-pause performance, wetting, and coalescence.
全球技术奖由Global SMT & Packaging 颁发，旨在表彰过去 12 个月中印刷电路板组装和包装行业推出的最佳创新产品。
"产品开发专家凯文-布伦南（Kevin Brennan）说："我们很荣幸能够接受这一享有盛誉的创新奖，并为我们的敬业同事感到无比自豪，他们开发的 Indium8.9HFRV 是满足客户需求的独特解决方案。"Indium8.9HFRV是高可靠性合金系统的上佳选择，具有出色的空泡性能、热循环可靠性以及电化学可靠性。
Indium8.9HFRV is a flux vehicle and drop-in solution fully compatible with the standard SnAgCu, SnAgCuSb high-reliability alloy systems favored by the electronics industry, and Indium Corporation’s enhanced thermal cycling, low-voiding alloy, Durafuse® HR. It is also compatible with both air and nitrogen reflow environments. It is designed for no-clean applications; however, the flux can be removed, if necessary, by using a commercially available flux residue remover. It also features high transfer efficiency through small apertures and can be coupled with Type 4 and Type 5 powder sizes.
关于铟泰铟泰公司
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
