Indium Corporation's Maria Durham, technical support engineer for semiconductor and advanced assembly materials, will present at IMAPS's International Conference and Exhibition on Device Packaging March 17-19 in Scottsdale, Ariz.
半导体组装行业继续向更细间距发展，同时降低铜柱高度。因此，清洗工艺变得越来越困难。Durham 在题为 "用于倒装芯片和 MEM 应用的超低残留 (ULR) 半导体级助焊剂"的演讲中讨论了如何使用半导体级超低残留免清洗助焊剂来应对这一行业挑战。她的演讲还将讨论使用 ULR 免清洗助焊剂的好处。
Durham serves as technical liaison between Indium Corporation's customers and internal departments, such as sales, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor's degree in physics and applied mathematics from Clarkson University, Potsdam, N.Y.
IMAPS是致力于通过专业教育促进微电子和电子封装技术进步与发展的最大协会。学会的技术组合通过研讨会、会议、讲习班、专业发展课程和其他活动进行传播。IMAPS 目前在美国有 3000 多名会员，在全球有 3000 多名国际会员。
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.
