Indium Corporation experts will present their technical findings at SMTA International, October 16-20, 2011, in Fort Worth, TX.
Indium Corporation’s Vice President of Technology Dr. Ning-Cheng Lee will present three papers. The first, High Temperature Lead-Free Solder Joints via Mixed Powder System, talks about the research that was done to develop a mixed powder solder paste technology to design alternative high-temperature, lead-free solder pastes.
Lee 博士的第二个演讲题目是 "使用 SAC105Ti 焊球的 BGA 组装性能"，讨论了一种新型合金在跌落测试中的改进性能，这种合金旨在降低 BGA/CSP 组装器件中锡银铜 (SAC) 焊点的脆性。
他的第三个演讲题为 "QFN 组装中的空洞控制"，将对各种热垫设计、钢网图案和回流曲线进行评估，并确定最大限度减少空洞的最佳条件。
技术支持工程师 Nicole Palma 将介绍SIR、卤化物/卤素和铜镜测试的相关性。本文将解释这些测试技术背后的理论、它们之间的区别，以及助焊剂活化剂中卤化物的存在将如何影响 SIR 和铜镜测试结果。
印刷电路板组装材料产品支持专家布鲁克-桑迪（Brook Sandy）将发表题为 "为印刷电路板组装选择 SAC 合金的低成本替代品 "的演讲：初步工作。本文概述了用于无铅组装的近共晶 SAC 合金的低成本替代品，包括与现有替代品相比的性能，以及提高低成本焊料合金性能的方法。
产品专家Seth J. Homer 将介绍使用焊料预型件最大限度地减少 QFN 封装中的空洞。本文量化了在标准 SMT 工艺中使用预型件所需的预型件要求和工艺调整。此外，还将介绍使用预型件减少空洞的实验数据。
Lee 博士是世界知名的焊接专家，也是 SMTA 的杰出会员。他在高温聚合物、微电子封装材料、填充物和粘合剂的开发方面拥有丰富的经验。他目前的研究兴趣涵盖电子和光电应用领域中用于互连和封装的先进材料，重点是高性能和低成本。
Nicole joined Indium Corporation in 2004 and spent several years in Quality as a Senior Quality Engineer, focused on SMT solder paste and semiconductor flux products. She now provides technical assistance on the selection, use, and application of solder paste, flux, and engineered solders. Nicole has a bachelor’s degree in Biochemistry from Daemen College in Amherst, NY. She is a Certified Quality Engineer from the American Society of Quality and is certified as a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College.
布鲁克是客户与研发和生产等内部部门之间的技术联络人，以确保最佳的产品质量和产品选择。她还协助改进信息资料，为 PCB 组装材料客户提供帮助。布鲁克曾就读于罗德岛大学国际工程专业，并获得化学工程（材料方向）和德语学位。她还撰写了博客，可在blogs.indium.com/blog/brooksandy 上找到。
Seth has been with Indium Corporation for over 15 years, serving as manufacturing supervisor for various engineered electronics assembly materials, including solder spheres, sputtering targets, indium chemicals, and solder preforms. Seth has also worked extensively with Indium Corporation customer support teams, especially those in China, Singapore, and Europe. He also authors a blog which can be found at blogs.indium.com/blog/seth-j-homer.
Indium Corporation will be exhibiting at booth #321.
有关 SMTAI 2011 的更多信息，请访问www.smta.org。
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation visit indiumstg.wpenginepowered.com or email [email protected].
