Indium Corporation experts will present their technical findings at SMTA International, October 16-20, 2011, in Fort Worth, TX.
Indium Corporation’s Vice President of Technology Dr. Ning-Cheng Lee will present three papers. The first, High Temperature Lead-Free Solder Joints via Mixed Powder System, talks about the research that was done to develop a mixed powder solder paste technology to design alternative high-temperature, lead-free solder pastes.
Dr. Lee’s second presentation includes Performance of BGA Assembly Using SAC105Ti Solder Spheres, which discusses the improved drop test performance of a new alloy, designed to reduce the fragility of SnAgCu (SAC) solder joints in assembled BGA/CSP devices.
His third presentation, Voiding Control at QFN Assembly, will evaluate various designs of thermal pads, stencil patterns, and reflow profiles and identify the optimal conditions to minimize voiding.
Nicole Palma, Technical Support Engineer, will present Correlation of SIR, Halide/Halogen, and Copper Mirror Tests. This paper explains the theories behind these test techniques, their differences, and how the presence of halides in the flux activators will affect the SIR and copper mirror results.
Brook Sandy, Product Support Specialist of PCB Assembly Materials, will present Choosing a Low Cost Alternative to SAC Alloys for PCB Assembly: Preliminary Work. This paper outlines low cost alternatives to near-eutectic SAC alloys for Pb-free assembly, including performance as compared to current options, and approaches to enhance the performance of low-cost solder alloys.
Seth J. Homer, Product Specialist, will present Minimizing Voiding in QFN Packages Using Solder Preforms. This paper quantifies the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing void reduction using preforms will also be presented.
李博士是世界知名的焊接专家，也是SMTA的杰出会员。他在高温聚合物、微电子封装材料、底部填充材料和粘合剂的研发方面拥有丰富的经验。他目前的研究兴趣涵盖用于电子和应用互连及封装先进材料，重点兼顾高性能与总体成本低。
Nicole joined Indium Corporation in 2004 and spent several years in Quality as a Senior Quality Engineer, focused on SMT solder paste and semiconductor flux products. She now provides technical assistance on the selection, use, and application of solder paste, flux, and engineered solders. Nicole has a bachelor’s degree in Biochemistry from Daemen College in Amherst, NY. She is a Certified Quality Engineer from the American Society of Quality and is certified as a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College.
Brook acts as a technical liaison between our customers and internal departments, such as R&D and production, to insure the best quality and selection of products. She also provides support in improving informational materials to assist PCB assembly materials customers. Brook attended the University of Rhode Island in the International Engineering Program, and earned degrees in Chemical Engineering (with a focus on materials) and German Language. She also authors a blog which can be found at blogs.indium.com/blog/brooksandy.
Seth has been with Indium Corporation for over 15 years, serving as manufacturing supervisor for various engineered electronics assembly materials, including solder spheres, sputtering targets, indium chemicals, and solder preforms. Seth has also worked extensively with Indium Corporation customer support teams, especially those in China, Singapore, and Europe. He also authors a blog which can be found at blogs.indium.com/blog/seth-j-homer.
Indium Corporation will be exhibiting at booth #321.
有关 SMTAI 2011 的更多信息，请访问www.smta.org。
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料供应商。 产品包括焊料、焊片助焊剂；硬钎焊；溅射靶材；铟、镓（Ga）和锗的化学品及采购服务；以及Reactive NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、新加坡、韩国、英国和美国设有工厂。
如需了解有关铟泰公司 更多信息，铟泰公司 indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。
