Indium Corporation will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20.
Indium Corporation is a leading solder supplier for laser and optical applications. Gold-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible.
Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Indium Corporations gold-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical,
high-reliability die-attach applications. Features include:
- 高精度焊接量和 BLT 控制
- 精密的边缘质量
- 平整、无翘曲或弯曲
- 优化清洁度控制
- 默认的华夫饼包装方法
Indium Corporations gold PDA preforms are available in the following primary and development alloys:
主要合金：
- 80Au/20Sn
- 79Au/21Sn
开发合金：
- 78Au/22Sn; 77Au/23Sn; 76Au/24Sn; 75Au/25Sn
- 88Au/12Ge
- 96.8金/3.2硅
- 82Au/18In
Indium Corporations AuLTRA 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition, and improving wetting and voiding. The AuLTRA product line also comes in 78Au/22Sn and 79Au/21Sn compositions.
Indium Corporations AuLTRA ThInFORMS are 0.00035-thick (0.00889mm or 8.89m) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA ThInFORMS help combat common issues such as:
- Shortingreduced solder volume inhibits wicking up the die, minimizing the risk of shorting
- Poor thermal transferthe ultra-thin 0.00035 preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device
Indium Corporations AuLTRA Fine Ribbon is our Indalloy182 fine-grade precision ribbon, for high-volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance along with long, continuous lengths. These features help minimize production downtime and facilitate an efficient, high-throughput process resulting in a high-quality end product and low cost of ownership.
A leading gold solder innovator, Indium Corporations gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au/20Sn: the pillar alloy of the microelectronics industry with a melting point of 280C, 80Au/20Sn works great in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporations AuSn solder offers numerous benefits including: Highest tensile strength of any solder High melting point compatible with subsequent reflow processes Superior thermal conductivity Resistance to corrosion
To learn more about Indium Corporations precision Au-based preforms, visit indiumstg.wpenginepowered.com/products/solders/gold/gold-preforms or stop by booth #214 at the show.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
关于国际微波研讨会
70 多年来，国际射频和微波展览会汇聚了众多国际射频和微波专家，介绍最新研究成果，展示最新产品和服务。IMS 包括教育和交流机会以及展览。了解更多信息，请访问ims-ieee.org。
