热泉

Indium Corporation’s patented Heat-Spring® is a soft metal alloy thermal interface material (SMA-TIM) designed as a flexible, patterned foil that serves as an effective thermal conduit between two surfaces. This innovative product is intended for use in a range of high-performance applications, including TIM2, TIM3, TIM1.5, burn-in processes, and immersion cooling systems.

技术支持:铟泰公司

  • Ultra-Low Thermal Resistance
  • No Reflow or High-Temperature Cure
  • Proven Reliability
胶片带特写,上面印有徽标和文字 "INDUV "和 "SIA",背景为蓝色。
产品Recommended Applications厚度范围特殊功能
HSD弹簧Small, well-designed interfaces with flat, smooth, and parallel surfaces (2-3mil non-planar).最小0.004″ (100µm)
最大: 0.016″ (400µm)
针对扁平、流畅的界面进行了优化。
HSHP热泉Applications with extruded, unfinished heat-sinks or field-fit plates with surface scarring or machine marks.
Can also be used in HSD applications.
Recommended for immersion cooling (2-5mil non-planar).
最小:0.006 英寸(150 微米0.006″ (150µm)
最大: 0.016″ (400µm)
HSD 的高调变体,具有 2 倍的可压缩性。
HSK热泉Burn-in applications requiring multiple insertions.
Features pure indium with an aluminum-clad barrier layer for durability.
最小:0.006 英寸(150 微米0.006″ (150µm)
最大: 0.016″ (400µm)
Aluminum barrier prevents adhesion, staining, and cracking.
HSx 热弹簧Applications with large CTE mismatches, curved dies, or warping issues.
Recommended for immersion cooling (5-10mil non-planar).
Min:0 .012″ (300µm)
Max: 0.040″ (1,000µm)
HSHP 的高配置变体,压缩性为 2 倍。在压力较低时也能很好地工作。

清洁和可重修的 TIM

可回收和再循环

大批量生产

可定制合金

Passes Thermal Cycling, Power Cycling, and HAST Testing

Graph showing thermal resistance over 1200 cycles for thermal grease, polymeric phase-change TIM, and compressible indium TIM.

产品数据表

InTACK® Robust Tacking Agent for Integration with Heat-Spring® PDS 100117 (A4) R1.pdf
InTACK® Robust Tacking Agent for Integration with Heat-Spring® PDS 100117 R1.pdf
Heat-Spring®–Ultra-Low 降低热阻 TIM1.5,2,3 PDS 100326 R1.pdf

相关应用

Heat-Spring® preforms are available for use in a variety of applications.

一张电路板 热成像图电路板 温度分布不均的区域:明亮的橙色和黄色表示热点,而较冷的区域则呈现为紫色和蓝色。

半导体测试

采用软金属合金的半导体测试解决方案……

一张微芯片的特写照片,芯片上方覆盖着一层导热垫,并放置在电路板板上。

浸入式冷却

一种正在兴起的热处理技术……

一张带有透明覆盖层的微芯片插图,展示了内部元器件 电子连接,突显了其堪比腕表设计的精密程度。

计时器 1、计时器 1.5、计时器 2

金属基热界面材料(TIM)具有出色的导热性能,并且……

相关市场

Indium Corporation’s Heat-Spring® preforms are used in a wide-range of markets.

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