可压缩
热泉
Indium Corporation’s patented Heat-Spring® is a soft metal alloy thermal interface material (SMA-TIM) designed as a flexible, patterned foil that serves as an effective thermal conduit between two surfaces. This innovative product is intended for use in a range of high-performance applications, including TIM2, TIM3, TIM1.5, burn-in processes, and immersion cooling systems.
技术支持:铟泰公司
- Ultra-Low Thermal Resistance
- No Reflow or High-Temperature Cure
- Proven Reliability

产品概览
| 产品 | Recommended Applications | 厚度范围 | 特殊功能 |
|---|---|---|---|
| HSD热弹簧 | Small, well-designed interfaces with flat, smooth, and parallel surfaces (2-3mil non-planar). | 最小0.004″ (100µm) 最大: 0.016″ (400µm) | 针对扁平、流畅的界面进行了优化。 |
| HSHP热泉 | Applications with extruded, unfinished heat-sinks or field-fit plates with surface scarring or machine marks. Can also be used in HSD applications. Recommended for immersion cooling (2-5mil non-planar). | 最小:0.006 英寸(150 微米0.006″ (150µm) 最大: 0.016″ (400µm) | HSD 的高调变体,具有 2 倍的可压缩性。 |
| HSK热泉 | Burn-in applications requiring multiple insertions. Features pure indium with an aluminum-clad barrier layer for durability. | 最小:0.006 英寸(150 微米0.006″ (150µm) 最大: 0.016″ (400µm) | Aluminum barrier prevents adhesion, staining, and cracking. |
| HSx 热弹簧 | Applications with large CTE mismatches, curved dies, or warping issues. Recommended for immersion cooling (5-10mil non-planar). | Min:0 .012″ (300µm) Max: 0.040″ (1,000µm) | HSHP 的高配置变体,压缩性为 2 倍。在压力较低时也能很好地工作。 |
特点
Compressible thermal interface material (TIM) operates on the principle that two surfaces joined with metal will effectively conduct heat. A unique pattern is applied to the flat metal shim, creating an array of individual compressible columns that transfer heat independently. Because metal TIM materials possess high thermal conductivity, the interface resistance is only minimally influenced by the thickness of the TIM.
产品数据表
InTACK® Robust Tacking Agent for Integration with Heat-Spring® PDS 100117 (A4) R1.pdf
InTACK® Robust Tacking Agent for Integration with Heat-Spring® PDS 100117 R1.pdf
Heat-Spring®–Ultra-Low 降低热阻 TIM1.5,2,3 PDS 100326 R1.pdf
相关应用
Heat-Spring® preforms are available for use in a variety of applications.
相关市场
Indium Corporation’s Heat-Spring® preforms are used in a wide-range of markets.
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