プレスリリース

to Research and Development Director CLINTON, N.Y., September 3, 2026 — Indium Corporation has promoted Hongwen Zhang, Ph.D., to Research and Development (R&D) Director. In this role, he will

TAIPEI, Taiwan, September 2, 2026 — As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge

CLINTON, N.Y., September 1, 2026 — With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will feature its portfolio of high-performance

CLINTON, N.Y., August 31, 2026 — Indium Corporation® Senior Area Technical Manager Luis Pan will discuss how precisely matching materials and assembly processes can positively impact yield and

CLINTON, N.Y., August 28, 2026 — Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges

CLINTON, N.Y., August 24, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and

CLINTON, N.Y., August 21, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging

CLINTON, N.Y., August 20, 2026 – As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability

CLINTON, N.Y., August 11, 2026 — Innovation begins with people and—for the 14th consecutive year—Indium Corporation’s award-winning summer internship program has cultivated the next

CLINTON, N.Y., August 11, 2026 — Indium Corporation, a leading provider of innovative materials solutions for electronics assembly, semiconductor packaging, and thermal management applications,

CLINTON, N.Y., July 30, 2026 — As a leading provider of high-reliability soldering and sintering materials for power electronics devices, Indium Corporation experts will share new research and

CLINTON, N.Y., July 2, 2026 — Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will present research on the use of thermal interface

2026年6月3日、ニューヨーク州クリントン発 — インジウム・コーポレーション®とエイムズ国立研究所は、重要な材料であるガリウムの米国国内生産を拡大するための研究開発提携を発表した。

2026年6月1日、ニューヨーク州クリントン発 — Indium Corporation®のシニア・エリア・テクニカル・マネージャー、レオ・フー氏は、先進的な金属熱界面材料（TIM）がどのようにして新たな性能水準を達成できるかについて、

2026年5月29日、ニューヨーク州クリントン発 – 重要なRF/マイクロ波用途向けの革新的な材料ソリューションにおける業界リーダーであるインジウム・コーポレーション®は、高信頼性の金系

ニューヨーク州クリントン、2026年5月xx日 – あらゆるパワーエレクトロニクスデバイス向けの高信頼性材料のリーディングプロバイダーであるインジウム・コーポレーション®は、PCIMにおいて、AI活用を可能にする製品ポートフォリオを展示する予定です。

2026年5月26日、ニューヨーク州クリントン発 — パワーエレクトロニクス機器向けの高信頼性はんだ、焼結材、および熱界面材料の主要プロバイダーであるインジウム・コーポレーション®は、3つの製品を展示する予定です。

CLINTON, N.Y., May 21, 2026 – As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will showcase its high-reliability portfolio of

CLINTON, N.Y., May 15, 2026 — Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of

CLINTON, N.Y., May 13, 2026 — Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder

CLINTON, N.Y., May 12, 2026 — As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge