Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will give two presentations and teach a professional development course at the International Conference on Electronic Packaging Technology (ICEPT), August 11-14, in Dalian, China.
- Low Cost High Reliability Assembly of Thermally Warped PoP with Novel Epoxy Flux on Solder Paste – In this presentation, Dr. Lee discusses a newly developed epoxy flux, compatible with solder paste, to address the drop failure of area array packages, such as BGAs, CSPs, and PoP.
- Shock Resistant and Thermally Reliable Low-Ag SAC Solder Doped with Mn – This presentation discusses a new soldering alloy doped with Mn, and its considerable improvement in shock resistance and thermal fatigue performance.
- Electromigration – The Hurdle for Miniaturization and High Power Devices – This professional development course covers all critical aspects of electromigration of solder joints, including failure mechanism, effect of solder alloy composition, solder joint metallurgy and configuration, pad design, pad composition, current density, temperature, and current polarity. Additionally, this course reviews and discusses electromigration behavior within the redistribution layer.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
ICEPT 为期四天，内容包括技术会议、特邀演讲、专业发展课程/论坛、展览和社交活动。它涵盖了电子封装、制造和封装设备领域的最新技术发展，并为探索中国的研发和商业趋势提供了机会。
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
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