博客

Recently, I’ve fielded several requests to clarify the distinction between “halide-free” and “halogen-free.” Both terms apply to the composition of soldering fluxes in

各位，罗恩博士：在接下来的几篇帖子中，我想铟泰公司 导热界面材料（TIMs） 乔恩·梅杰聊聊金属TIMs的话题。乔恩，你能跟我们说说吗

Happy International Women in Engineering Day! Science was once considered a male-dominated field, with many important discoveries spearheaded by women gone unnoticed. That is no longer true, and as a

朋友们，大约一年前，我发表过一篇关于温度应力测试中加速度因素的文章。请看下面公式 1 中的等式。我弄错了指数，不应该是 5.5，而应该是 2.65。该

各位，很难想象《帕蒂和教授历险记》问世已经 15 年了。它从几篇博客文章开始，一直延续到现在、

Dear Dr. Ron, We are experiencing some graping on BGA solder joints. One of my colleagues said he heard that using square versus our current round stencil apertures might solve the

Folks, Let’s see how Ivy Universitygraduate student Maria Gonzales is handling her assignment to find the lost profits a Liberty Elecronics… Maria had never been so nervous. She was going

各位，让我们来看看帕蒂教授在做什么......帕蒂-科尔曼教授凝视着窗外艾毅大学校园里的残雪。她很遗憾

朋友们，想到我经历了电子革命的大部分时期，我不禁肃然起敬。在我最初的记忆中，我家和其他大多数人家一样，都没有一台电视机。

Folks, Can it be almost 20 years ago that I developed the solder alloy density calculator? I have received more requests on this topic than any other. It surprises most people that the formula for

朋友们，我记得在 1994 年（有 30 年了吧？），一位同事曾说过，再过 5 年，波峰焊就会消失。30 年过去了，波峰焊依然存在。因为

各位，Cp 和 Cpk 假设尊重 目标尊重 规格限是对称的尊重 然而，有时规格限并非对称的。例如，IPC 610 建议，对于钢网

先进封装技术不断发展，各种互连技术正朝着异构化的方向迈进。

Thermal management is becoming an ever more critical challenge for semiconductor devices, as the functional density and power density increase – especially with advanced packaging. Thermal test

As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing. Often, challenges in precision die bonding, for

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab, and

Artificial intelligence and machine learning (AI/ML) can have various applications in smart manufacturing for semiconductor fab, advanced packaging, and electronics manufacturing, and it typically

In recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach. When compared to traditional solders, silver sinter offers numerous benefits

各位，让我们来听听常春藤大学教授帕蒂-科尔曼（Patty Coleman）与约翰-阿彻（John Archer）谈论沃尔特-艾萨克森（Walter Isaacson）的《埃隆-马斯克传》。"我不得不承认，阅读关于

对低温和中温焊料的典型分析侧重于抗冲击性和元件弹性等重要指标的改进。但鲜为人知的是，更鲜为人知的是

电气化正在改变产品和材料的价值。目前，对可再生能源的投资是化石燃料的 1.7 倍，而对环境、社会和经济的利用则是化石燃料的 1.7 倍。