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Empowering Women in Engineering, Today and Everyday
Happy International Women in Engineering Day! Science was once considered a male-dominated field, with many important discoveries spearheaded by women gone unnoticed. That is no longer true, and as a
Square vs Circular Apertures May Reduce Graping
Dear Dr. Ron, We are experiencing some graping on BGA solder joints. One of my colleagues said he heard that using square versus our current round stencil apertures might solve the
结论:利润下降。便宜的焊膏会导致利润下降吗?
Folks, Let’s see how Ivy Universitygraduate student Maria Gonzales is handling her assignment to find the lost profits a Liberty Elecronics… Maria had never been so nervous. She was going
用于先进半导体封装的热测试芯片 (TTC)
Thermal management is becoming an ever more critical challenge for semiconductor devices, as the functional density and power density increase – especially with advanced packaging. Thermal test
ML/AI 在半导体封装和电子制造中的应用
As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing. Often, challenges in precision die bonding, for
互连可靠性:从芯片到系统
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab, and
自适应控制:半导体智能制造领域的“圣杯”
Artificial intelligence and machine learning (AI/ML) can have various applications in smart manufacturing for semiconductor fab, advanced packaging, and electronics manufacturing, and it typically
Sinter Material for Power Electronics – Copper’s Time to Shine?
In recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach. When compared to traditional solders, silver sinter offers numerous benefits
埃隆-马斯克传记 结论
各位,让我们来听听常春藤大学教授帕蒂-科尔曼(Patty Coleman)与约翰-阿彻(John Archer)谈论沃尔特-艾萨克森(Walter Isaacson)的《埃隆-马斯克传》。"我不得不承认,阅读关于
The Value of Low-Temperature Solder Alloys in an ESG World
电气化正在改变产品和材料的价值。目前,对可再生能源的投资是化石燃料的 1.7 倍,而对环境、社会和经济的利用则是化石燃料的 1.7 倍。
使用方差分析(ANOVA)比较三种或更多种焊膏的“类似于转印效率
专访 Patty Coleman 教授。罗恩博士科尔曼教授,我们已经很久没有聊天了。帕蒂教授:我同意,太久了!罗恩博士,请叫我帕蒂。博士
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