Seth Homer: As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use solder at the die-attach, DBC Substrate, and Baseplate level, we can achieve a more reliable IGBT that can form at increasingly higher standards. If you missed that video, be sure to check it out at indiumstg.wpenginepowered.com/IGBT.
今天，我们将具体讨论芯片连接层面。鉴于上述 IGBT 需求的增长，可靠性能从这里开始。芯片一开始就很脆弱，但当它们经受了功率循环的严格考验后，连接方式的选择就变得尤为重要。
与贴合方法有关的模具故障有三个关键因素。空洞、粘合线厚度和粘合线平面度。
空泡可能是润湿不良和污染的危险症状。如果焊料和接合面之间没有冶金关系，就没有润湿力将污染造成的挥发物挤出。如果合金选择不当和加工温度过高，也会出现这种现象。所有这些都会影响模具的性能。
说到键合线厚度，直觉上较薄的键合线表示较好的热路径。虽然这是事实，但并不总能转化为长期可靠性。超薄键合线也会导致接合处薄弱，没有散装焊料来缓冲金属间层。
最后，虽然键合线的平面度在各个层面都很重要，但在模具层面最为重要。如果键合线的一侧较薄，就会因应力不均而导致分层或开裂。那么，如何才能在芯片连接层面实现卓越性能呢？答案就是为贴片级用途设计和制造的超纯焊料合金。这将确保在无助焊剂连接系统中成功润湿并减少空洞。
Indium Corporation offers semiconductor-grade ribbon and preforms in ultra-pure alloys. These materials are available in adaptable packaging such as tape and reel, custom spools, and waffle trays to increase productivity, performance, and efficiencies. In cases where a flux is needed, we provide flux-coating formulations that achieve minimal voiding and good wetting.
Indium Corporation's LV1000 flux coating for solder preforms consists of both a unique flux formulation and application process to produce flux coated solder preforms that meet the tightest tolerances for flatness. This minimizes defects by ensuring the electronic components solder correctly.
有关芯片连接材料和 IGBT 的更多信息，请访问 indium.com/IGBT。如有任何问题，请直接与我联系，[email protected]。
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