Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado. The presentation, part of the Advanced Die Bond and Board Level Reliability session, will examine the findings from technical paper, The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications.
To address the impending need for replacement of high-lead (Hi-Pb) solders in die-attach and clip-bond usage for power discrete semiconductor applications, tin-antimony (SnSb)-based solder pastes have been developed with Indium Corporations patented Durafuse technology, which combines the merits of the two constituent powders. The study found that the mechanical strength of the reflowed joints around temperatures of 260C or higher, inherited from the Sb-bearing powder, was still comparable to or stronger than high-lead solders.
Although the current technology supporting lead-free materials is not yet sufficient to replace commonly used high-Pb options for this application, the results of this study may signal a potential way forward, said Aserian. I look forward to sharing these promising findings, as well as the challenges still present with my colleagues at ECTC.
Since joining Indium Corporation in 2022, Aserian has been at the forefront of designing and executing experiments to test the efficacy of new and existing alloys. His work involves creating processing windows tailored to customers needs, ensuring stringent quality inspection, devising innovative test methods, and reliability testing for developed soldering materials.
Indium Corporation Senior Research Chemist Dr. Guangyu Fan and Research Associate Jacob Wells will also present a poster at the conference, Thermal Performance and Reliability of Liquid Metal Alloys as Thermal Interface Materials for Computing Electronics Devices.
This poster examines recent efforts to develop liquid metal TIMs containing organic compounds (LMO) that enhance the deposit process and thermal performance for improved thermal management in electronic devices. The thermal conductivity, resistance, and reliability of LMOs and LMAs were measured using TIMA 5 (ASTM-D5470) and evaluated by a house-made power cycler, respectively.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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