Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the IPC Component-to-System Level Packaging Workshop, scheduled for July 2-3, 2025, in Berlin, Germany.
The presentation, Solder as Known Good Interconnect (KGI) in Heterogeneous Integration, will explore how solder and low-melting metals and metal alloys have evolved over the past 50 years, as well as the challenges ahead for assembly processes and reliability as new devices drive new power, performance, volume, and cost requirements.
“Hybrid bonding or direct bonding remains of significant interest for any company creating advanced packaged and heterogeneous integrated devices. However, hybrid bonding will likely remain a post-back-end-of-line process within wafer and system foundries due to its sensitivity to particulates and specificities of CMP and surface conditioning,” said Dr. Mackie. “For outsourced semiconductor assembly and test companies and others seeking a more simplified approach, solder and the reflow process remain the primary means of creating a known good interconnect.”
マッキー博士は、新素材、新興技術、およびそれらがビジネスに及ぼす潜在的な影響の融合を専門とするエレクトロニクス業界の専門家です。その専門的な経験は、ウェハー製造から半導体組立・パッケージング、さらにはSMT／電子機器組立に至るまで、エレクトロニクス製造における材料およびプロセスのあらゆる側面を網羅しています。
In his current role at Indium Corporation, Dr. Mackie focuses on identifying thermal material needs and trends for various high-performance applications, as well as developing and testing innovative solutions to meet emerging thermal interface material requirements.
Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie has a Ph.D. in physical chemistry from the University of Nottingham, UK, and a master of science degree (MSc) in colloid and interface science from the University of Bristol, UK.
The presentation will take place on Thursday, July 3, from 8:30 to 10:10 a.m.
To learn more about Indium Corporation’s solder solutions, visit https://www.indium.com/.
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