Indium Corporation announces a soft metal alloy thermal interface material (SMA TIM) that offers high and uniform thermal resistance at lower applied stresses in compressed interfaces.
The company’s patented Heat-Spring® SMA TIM reduces thermal resistance and enhances cooling by utilizing two key properties of indium metal: superior thermal conductivity and malleability. Unlike standard thermal interface materials, Heat-Spring offers an extremely long service life as it does not pump out under power cycling, nor does it bake out over time. This combination of high conductance, high surface contact area (due to superior conformance), and low degradation over time produces a superior thermal interface and assures optimized long-term device performance.
Heat-Spring’s high and uniform thermal conductivity is enhanced further when placed under compression (35 to 100 psi).
Learn more at indiumstg.wpenginepowered.com/heat-spring or by contacting the company at [email protected].
铟泰公司 面向全球电子、半导体、薄膜、热管理及太阳能市场的顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
