Indium Corporation continues to innovate alloy technologies with a new high-performance, high-reliability low-temperature alloy.
Durafuse™LT 是一种新型低温合金系统，旨在为要求回流焊温度低于 210°C 的低温应用提供高可靠性。传统的低温焊料通常会产生易受跌落冲击影响的脆性焊点，而 Durafuse LT 可提供更好的跌落冲击弹性，优于 BiSn 或 BiSnAg 合金，并且在最佳工艺设置下性能优于 SAC305。Durafuse LT：
- 为热敏元件和柔性聚合物提供解决方案
- 防止处理器组件和多层电路板发生热翘曲
- 满足台阶焊接的低温要求，特别是在射频屏蔽连接和返工应用中
To learn more about Indium Corporation’s 200+ alloy products, visit https://www.indium.com/solders/solder-alloys/.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
