Indium Corporation will feature its ultra-reliable, void-reducing Indium8.9HF Solder Paste for automotive applications at SMTA International, September 22-26, Rosemont, Illinois, USA.
Indium8.9HF 是一个成熟的焊膏系列，提供免清洗、无卤素的解决方案，旨在产生低空洞、增强电气可靠性并提高印刷过程中的稳定性。Indium8.9HF 是专为适应汽车电子行业青睐的锡银铜、锡银和其他合金体系所需的较高加工温度而配制的：
- 在冷藏条件下，可在长达 12 个月的时间内保持稳定的印刷和回流焊性能
- 在室温下放置一个月后仍能保持出色的印刷和回流焊性能
- 即使在网板上放置 60 个小时，也能提供出色的响应暂停印刷性能
- 适用于铅合金和无铅合金
Indium8.9HF 具有独特的氧化阻隔技术，可消除 HIP 缺陷和石墨化，因此非常适合汽车应用。它还能以多种方式提高汽车产品的可靠性：
- 超出所有要求，增强电气可靠性和 SIR 性能
- 经过行业验证的低空泡性能可提高导热性和热可靠性
- 防止助焊剂过早扩散，防止表面氧化
- 符合 HKMC MS184-01 B 类测试标准--汽车行业最严格的可靠性标准之一
For information on Indium8.9HF and its use in the automotive industry, visit indiumstg.wpenginepowered.com/avoidthevoid or visit booth #515.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
