Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the Minerals, Metals, and Materials Society (TMS) on March 7, 2013 in San Antonio, Texas.
Dr. Zhang’s presentation, Reliability of Lead-Free BiAgX Pastes for High-Temperature Die Attach Applications, explains the research involved in identifying lead-free alternatives for high-melting, high lead-containing solder alloys. The presentation also discusses a novel high-melting, lead-free, BiAgX® mixed solder paste system, and compares its performance to several representative high lead-containing solder alloys.
张博士是铟公司研发部的冶金研究专家。他的工作重点是开发用于高温和/或高抗疲劳应用的无铅焊接材料，以及相关技术的研究。他和李宁成博士发明了混合粉末焊料技术，其中使用了少量添加剂来改善润湿性和改变结合界面，从而提高结合强度。在这一技术的基础上，发明了BiAgX®焊接系统，作为高温无铅焊料的替代品。
Dr. HongWen Zhang has a bachelor’s degree in Metallurgical Physical Chemistry from Central South University of China, a master’s degree in Materials Science and Engineering from the Institute of Metal Research, Chinese Academy of Science, a master’s degree in Mechanical Engineering from Michigan Technological University, and a PhD in Materials Science and Engineering from Michigan Technological University.
TMS is a global organization headquartered in the United States that focuses on the entire range of materials and engineering, from minerals processing and primary metals production, to basic research and the advanced applications of materials.
Indium Corporation 是全球电子、半导体、太阳能、薄膜和热管理市场的主要材料供应商。产品包括焊料、预型件和助焊剂；钎料；溅射靶材；铟、镓和锗金属及化合物；以及 Reactive NanoFoil®。Indium Corporation 成立于 1934 年，在中国、新加坡、韩国、英国和美国拥有全球技术支持和工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。
